Silicon Wafers

CZ silicon wafers, FZ silicon wafers, ultra-thin silicon wafers, ultra-flat silicon wafers, polished silicon wafers, annealed silicon wafers, epitaxial wafers, single and multiple deposited metal, oxide and nitride layer silicon wafers. Examples of single layers: Si3N4, SiO2, metals (Au, Al, Cu, Ag, Ta, W, Cr, Ti, Pt, Mo etc), multiple layers: Si/SiO2/Si3N4/TiO2/Pt

Compound, Semiconductor, Wafers and Substrates

GaAs wafers, GaP wafers, SiC wafers, InP wafers, GaSb wafers, Ga2O3 wafers, InAs wafers, GaN wafers, Ge wafers, AlN wafers, LSAT wafers etc.

  Other Substrates

CdS, CdSe, CdTe, ZnO, MgO, ZnS, ZnSe, ZnTe, Sapphire (Al2O3), TiO2, YAG, YSZ, spinel, glass and fused silica substrates, metal substrates etc.

Piezoelectric Wafers

LiNbO3 wafers, LiTaO3 wafers, piezo quartz wafers, LGS langasite, LGT langatate, CTGS catangasite etc.

Thin films and epitxial layers on wafers

SOI wafers, Ge on Silicon epiwafers, SiGe on silicon epiwafers, GeSn on silicon epiwafers, 3C-SiC on silicon epiwafers, GaN on silicon epiwafers, GaN on sapphire templates, AlN templates, LiNbO3 and LiTaO3 thin films on Insulator (silicon/LT/QZ/sapphire), SiC epiwafers, GaAs based epiwafers (AlGaAs/GaAs, GaAsP/GaAs, InGaAsP/lGaAs, InGaAs/AlGaAs/GaAs, InAs/GaAs, AlGaAs/GaAs, AlInGaP/GaAs) for strained QW lasers, VCSEL, LED, QD lasers, passive waveguides. InP based epiwafers (InGaAsP/InP, InGaAs/InP, InGaAsP/InP, InAlGaAs/InP, InAlAs/InGaAs/InP) for HBT, HEMT, pHEMT, BiHEMT, APD, photodetectors, UV sensors, solar cells etc.

 Ceramic and Glass-to-Metal Packages

TO bases: TO-56, TO-46, TO-38, TO-65, TO-60, TO9, TO-18, TO-5, TO-8 and suitable caps with ball lens or window. XTAL packages: AT-51, AT-49, UM-1, UM-5, F-11, US-118 and suitable caps. Mini FlatPaK, MiniDIL, BTF PKG, Image Sensor Package, ceramic SMD package for LED, MEMS, XTAL, OSC, SAW filter. RF packages: LTCC, RF power transistor packages- metal wall and ceramic wall, waveguide port, multi-chip module (MCM) packages. CerDIP, C-SOP, CerQUAD, C-QFP, C-PGA, C-QFN, C-QFJ and lids. Open Cavity plastic packages

Assembly Materials

Bonding wire, die attach paste, die attach film (DAF), lead frames, epoxy molding compounds, die underfill materials, dam-and-fil compounds, casting compounds, cassettes, wire bonding capillaries, die collet, embossed carrier tape, dicing film, etc.

  Bare dice of IC, LED, transistor, diode chips

UV-A/UV-B/UV-C chips, visible LED chips AlInGaP, InGaN. IR LED chips: NIR, MIR, SWIR. Photodetector chips, PIN-PD, APD, FP-LD, DFB VCSEL chips, GaAs and GaN MMIC chips, shottky diode chips.

Other Materials, Components and Accessories

Photomask blanks, photomasks, photoresists, quartzware, diamond wire, diamond blades and grinding tools, antistatic bags, penals, trays. Wafer handling products-vacuum wands, Bernoulli handles. Wafer shipping products- single wafer shippers, jars, cassettes, boxes, canisters.

 Semiconductor, Fabrication, Equipments

Mask Aligner, Maskless lithography system, UV exposure system, Spin coater, Thin film deposition system, Etching and cleaning systems, wafer bonding equipment.

Assembly Equipment

Laser dicing system, Pick and place systems die bonder, wire bonder, seam sealer, lid tacker for ceramic packages, spray coater, dispensing system.

  Metrology and Test Equipment

AOI (automatic optical inspection) equipment, X-Ray inspection system, microscopy (SEM, TEM), thin film characterization equipment. Package test handler and sorter.

Standard

Obsolete and discontinued

Mass market products with standard characteristics. Packages plastic, ceramic SMD, DIP, AQP and other packages

We can design and produce products of world manufacturers with pin to pin compatibility, similar electrical characteristics and matching circuit.

Modified

Custom

We can modify some of standard products at a fraction of the cost of new development.

Electrical parameters and size according to specification
Custom packages, harsh environments, support from design to mass production

 SAW/BAW Products

SAW filters, delay lines, resonators, microstrip filters, sensors, microwave filters, BAW filterst

Crystal Products

Resonator, filter, oscillator, VCXO, TCXO, OCXO, XO, Sine Wave, frequency selective assemblies, sensors, Rb frequency standards

  Piezoceramic Materials, Components and Devices

Linear accelerometers, actuators, hydroacoustics, seismic sensors, angular speed sensors, filters, resonators, tilt platforms, micro switch relays, ultrasonic transducers

Relays and Switches

Optocouplers, photorelays, photointerrupters, S.S.R (solid state relays), optoelectronic modules, reed relays switches, electromechanical relays, overcurrent protection ICs

MEMS Products

Si generators, impact sensors, gyroscopes, accelerometers, 3D inertial measurement unit (IMU), airflow, pressure

Optoelectronics

NIR and MIR LEDs and arrays, SLED diodes and modules, GaAs/InP photodiodes and modules, laser diodes and modules, VCSEL, photodetectors, CCD image sensors, photo multiplier tubes, scintillators, image intensifier tubes, transceivers.

  RF/Microwave

MMIC, HMIC, FET, HEMT, pHEMT, HBT, diodes, modules, GaAs/GaN power amplifiers, ferrites, connectors, RF/MW frequency sources, filters, vacuum tubes.

Integrated Circuits

SoC, ASIC, microcontrollers, drivers, digital logic, DSP, operational amplifiers, ADC and DAC converters, voltage regulators, timers, telecom ICs etc.

  Power Descretes

IGBT, power thyristors and triacs, power diodes and arrays.

Sensors

SioS pressure and force sensors, gas sensors, vibration transducers, static-dynamic pressure sensors, acoustic emission transducers, vibration switches, force sensors, acoustic emission sensors